Package/System Design Engineer (PMIC SIP and Module)
QualcommBig techPackaging Engineering
57 daysopen
1–2 months · posted
Half of Qualcomm’s 1,997 open roles have been sitting longer than 79 days.
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Qualcomm has had this Package/System Design Engineer (PMIC SIP and Module) role in Hsinchu, Hsinchu City open for 57 days, since 26 June 2026. fable12 indexed it directly from Qualcomm's Eightfold board.
Details
- Location
- Hsinchu, Hsinchu City
- Workplace
- Not stated
- Source
- Qualcomm’s Eightfold boardLast seen 21 August 2026
