IC Package Design Engineer
QualcommBig techPackaging Engineering
3 monthsopen
2–12 months · posted
Half of Qualcomm’s 1,997 open roles have been sitting longer than 79 days.
Apply at Qualcomm →Opens Qualcomm’s own Eightfold board
Qualcomm has had this IC Package Design Engineer role in Hsinchu, Hsinchu City open for 3 months, since 13 May 2026. fable12 indexed it directly from Qualcomm's Eightfold board.
Details
- Location
- Hsinchu, Hsinchu City
- Workplace
- Not stated
- Source
- Qualcomm’s Eightfold boardLast seen 21 August 2026
