IC Packaging Staff Engineer - Assembly process/Characterization

QualcommBig techHardware Engineering

9 monthsbefore it closed

2–12 months · posted 26 November 2025 · closed 23 August 2026

Half of Qualcomm’s 1,878 open roles have been sitting longer than 80 days.

View the original posting →Left Eightfold — the page may be gone

Qualcomm kept this IC Packaging Staff Engineer - Assembly process/Characterization listing in Bengaluru, KA open for 9 months, from 26 November 2025. It closed on 23 August 2026. fable12 indexed it directly from Qualcomm's Eightfold board.

Location: Bengaluru, KA
Workplace: Not stated
Source: Qualcomm’s Eightfold boardLast seen 23 August 2026

Also open at Qualcomm

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IC Packaging Staff Engineer - Assembly process/Characterization

Details

Also open at Qualcomm

IC Packaging Staff Engineer - Assembly process/Characterization

Details

Also open at Qualcomm